1 AIT Asian Institute of Technology

Hinge-type energy dissipating element for low to medium rise buildings

AuthorSupachai Jaingam
Call NumberAIT Thesis no.OTM-13-04
Subject(s)Buildings--Vibration
Seismic reflection method

NoteA thesis submitted in partial fulfillment of the requirements for the degree of Master of Engineering in Offshore Technology and Management, School of Engineering and Technology
PublisherAsian Institute of Technology
Series StatementThesis ; no. OTM-13-04
AbstractUnder the earthquake event, buildings will be excite d by ground motion. Excessive vibration will cause damage and, then, colla pse in structures. Thus, researchers and engineers have attempted to limit the vibr ation through many different approaches, e.g. structural stiffening, base isolation, and en ergy dissipating element (EDE). Focusing on EDE, The EDE installation mostly occupies usable space in the building and disturbs architectural functions. This research introduces the new type of EDE which attach to the hinge that is installed in th e location of zero bending moment in the beams. The diagonal frame member is not required in this EDE. Fu rthermore, the installation of hinge in the beam reduces the stiffness of overall struct ure which helps lower structural response. Numerical models of buildings were cons tructed, and comparisons between ordinary structures and EDE inge equi pped structures were made. The results show significant reduction of base shear and base moment, resulted from EDE hinges, while the deformation is larger than ordinary frame structures.
Year2013
Corresponding Series Added EntryAsian Institute of Technology. Thesis ; no. OTM-13-04
TypeThesis
SchoolSchool of Engineering and Technology (SET)
DepartmentDepartment of Civil and Infrastucture Engineering (DCIE)
Academic Program/FoSOffshore Technology and Management (OTM)
Chairperson(s)Punchet Thammarak
Examination Committee(s)Pennung Warnitchai;Chiu, Gregory L.F.
Scholarship Donor(s)Asian Institute of Technology Fellowship
DegreeThesis (M. Eng.) - Asian Institute of Technology, 2013


Usage Metrics
View Detail0
Read PDF0
Download PDF0