| Abstract | Nowadays, there has been more use of computer aided engineering (CAE) since microcomputer has become more advanced in solving engineering problems. In addition, it is cost-efficient, convenient and fast in solving problems regarding the application of the cooling system with electronic parts; for example the study of the cooling system for high-speed microchips or central processing units (CPU), the simulation of the cooling system and the simulation of the heat transfer of microchips or CPU. Most of the researches in the past focused on the cooling system with one set of equipment using heat sink, heat pipe, water, or thermoelectric in the cooling process. However, this research focuses on the study and the design of the cooling system simulation model using two sets of equipment called the active cooling system and the passive cooling system compared with the cooling system in use nowadays.
In the first section of dissertation, the cooling systems in use nowadays were investigated. The simulation for the cooling system was created in order to study the efficiency of each cooling system. All existing cooling systems have insufficient capacity for cooling 200-watt heat dissipation. Realistic temperature distributions in the heat sink are of utmost importance hence physical designs of the model are necessary. The fan cooling system could shorten the life of the CHIP since the abrupt temperature increase to reach the maximum limit accompanied by the slow heat removed would require the component to always operate at elevated temperatures.
In the second section of dissertation, a new cooling system, combined sets of equipment of active cooling and passive cooling was developed. The combined cooling systems have sufficient capacity for cooling 200W heat dissipation. The temperature of the combined cooling system is lower than both existing cooling systems. The temperature of all components, i.e. the CPU, heat pipe, TEC and heat sink were below 75°C. The thermal resistance characteristic of a cooling system has a major effect on cooling performance. The existing cooling systems can shorten the life of the CHIP since the rapid increase of temperature to its maximum limit accompanied by slow heat removal requiring the component to be always operating at elevated temperatures.
In the last section of dissertation, the results of all cooling systems were compared. For the future work recommendation, it should concern with the following conditions: a) To study the higher-sized cooling systems such as the motor or electric transformers. b) To examine the application and development for specific software model accurately. c) To generate many concerned factors in the experiment, not for limited factors and they should effect on the size of equipment, the increase of heat degree, or even the thermal stress of the cooling systems. d) To study the ventilation in the computer box in order to design the equipment position for releasing the heat during the operation. |