| Author | Jittipong Dangtip |
| Note | A thesis submitted in partial fulfillment of the requirements for the
degree of Master of Science in Mechatronics, School of Engineering and Technology |
| Publisher | Asian Institute of Technology |
| Abstract | The grinding process in this study is slice-and-grind of AlTiC Chunk to produce slider bars of hard disk slider. Surface roughness of the obtained slider bars is critical to its performance. This is especially important for the subsequent lapping and air bearing surface creation. In this research different grinding wheel type of diamond grinding cup wheel is found to affect surface roughness of air bearing surface side, as well as amount of edge chipping and bowing of slider bar. Binder materials used for the study are vitrified bond and resin bond. Diamond grain size is varied as SD1200, SD1500, and SD2000. The cup wheel has a diameter of 69 mm with segment width of 2 mm. Feed rate is 1, 2.5, 4 mm/s, grinding depth is 1, 4, 9 micron, and spindle revolution is 10000 rpm. Design of experiment (DOE) full factorial design used to analyze main effect of parameter. From DOE result, grinding wheel type is high level affect to bar bow and surface roughness. It is found that the wheel with resin bond and diamond grain size of SD2000 has the best performance. The obtained surface roughness is less than 5 nm, and maximum bow of slider bar is +500 micron. |
| Year | 2014 |
| Type | Thesis |
| School | School of Engineering and Technology (SET) |
| Department | Department of Industrial Systems Engineering (DISE) |
| Academic Program/FoS | Microelectronics (ME) |
| Chairperson(s) | Bohez, Erik L. J. ; |
| Examination Committee(s) | Huynh Trung Luong;Ittipon Cheowanish; |
| Scholarship Donor(s) | Western Digital ;NECTEC, Thailand;AIT Fellowship; |