| Author | Natthapon Kongsaeng |
| Note | A thesis submitted in partial fulfillment of the requirements for the
degree of Master of Science in
Microelectronics Embedded Systems, School of Engineering and Technology |
| Publisher | Asian Institute of Technology |
| Abstract | This grinding process is studied to determine grinding parameters wheel speed, feed rate, coolant flow rate and diamond wheel segment length the influence to grinding wheel load(force) for increasing wafer back grinding machine utilization by decrease interval time of rough grinding wheel dressing and set up the grinding wheel. The determine is using design of experiment (DOE) to finding optimal point of grinding parameters to decrease grinding wheel load and less impact grinding wheel wear, material removal rate and surface roughness. The result is reduction feed rate and diamond wheel segment length then grinding wheel load will be decrease and get better surface roughness |
| Year | 2015 |
| Type | Thesis |
| School | School of Engineering and Technology (SET) |
| Department | Department of Industrial Systems Engineering (DISE) |
| Academic Program/FoS | Microelectronics (ME) |
| Chairperson(s) | Bohez, Erik L. J. ; |
| Examination Committee(s) | Huynh Trung Luong;Sarapong Choumwong; |
| Scholarship Donor(s) | Western Digital ;AIT Fellowship; |