| Author | Nootcharee Tarasaeng |
| Note | A thesis submitted in partial fulfillment of the requirements for the
degree of Master of Science in
Mechatronics, School of Engineering and Technology |
| Publisher | Asian Institute of Technology |
| Abstract | HDD manufacturing requires precise production process and time to delivery. It consists of
many components which HGA is one of HDD part. In manufacturing process have many
machines that concern. Solder Jet Bonding machine is the machine that bonding circuit
between slider pad and suspension pad. This machine is one of critical machine that direct
impact to productivity of line. In production line have condition machine control to achieve
output target. But Solder Jet Bonding machine can’t operate perfectly in condition control
because it has problem in process time control. Machine do not has timing chart to control
time of process step which it has many parameters that concern to each process.
This project will research standard time of Solder Jet Bonding machine process to achieve
productivity target. The research will analyze parameters that direct impact to process time
of Solder Jet Bonding machine auto alert technician to adjust it. All information can
improve UPH of machine and the better productivity of HGA line. |
| Year | 2012 |
| Type | Thesis |
| School | School of Engineering and Technology (SET) |
| Department | Department of Industrial Systems Engineering (DISE) |
| Academic Program/FoS | Microelectronics (ME) |
| Chairperson(s) | Mongkol Ekpanyapong; |
| Examination Committee(s) | Dailey , Matthew N. ;Khanittha Patmanee; |
| Scholarship Donor(s) | WDC fellowship ; |