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Study of high precision bonding process for heat assisted magnetic recording head | |
Author | Ouyang, Bin |
Note | A thesis submitted in fulfilment of the requirements for the degree of Master of Science in Mechatronics |
Publisher | Asian Institute of Technology |
Abstract | In past 20 years, hard disk drive (HDD) areal density was kept 40% annual growth rate. With current perpendicular magnetic recording technology, it reaches the physical limitation of the hard disk. This causes the inability to maintain the growth rate for future product therefor it will impact the cost effectiveness of the HDD. Heat assisted magnetic recording (HAMR) technology is one of the methods which can make this breakthrough to fulfil the growth rate. It introduces the higher magnetic coercivity material to further squeeze down the magnetic cell size without sacrificing the thermal stability. One additional laser source is designed to temporarily reduce the magnetic coercivity during the HAMR writing process. Typically, to integrate the laser source in the conventional magnetic writing process, it requires submicron level accuracy. This study targets to understand the post bonding accuracy of passive bonder which entitled submicron accuracy ability. Through series experiments, the research investigated the different variation which induced from every process step before bonding. The biggest portion was defined by this study and the improvement was verified by actual product build. At the last part of this study, it discussed the future opportunity to fulfil the high volume production requirement. |
Year | 2014 |
Type | Thesis |
School | School of Engineering and Technology (SET) |
Department | Department of Industrial Systems Engineering (DISE) |
Academic Program/FoS | Microelectronics (ME) |
Chairperson(s) | Afzulpurkar, Nitin V.;Bohez, Erik; |
Examination Committee(s) | Huynh Trung Luong;Lim, Chee Kheng ; |
Scholarship Donor(s) | Western Digital;AIT Fellowship; |