Stress distribution in trochanteric gamma nail during walking finite element method | |
| Author | Pisarn Pasutanon |
| Call Number | AIT Thesis no.ISE-03-33 |
| Subject(s) | Finite element method Fracture mechanics |
| Note | A thesis submitted in partial fulfillment of the requirements for the degree of Master of Engineering, School of Advanced Technologies |
| Publisher | Asian Institute of Technology |
| Series Statement | Thesis ; no. ISE-03-33 |
| Abstract | Numerical method as finite element analysis was used to investigate the stress distribution in Trochanteric Gamma Nail (TGN) during one walking cycle. The data from previous study in 108 Thai femur using the reverse engineering combined with computerised tomography images CT-scan to obtain the CAD geometry of femur was used [5]. Finite element models with 10-node tetrahedral elements were created in femur and TGN implant model. There were three parts of this study: firstly, the finite element analysis of healed trochanteric fixed with TGN was performed in seven frames of walking cycle, which data of force in %B W obtained from Bergmann et al [ 17]; secondly, the finite element analysis of fracture trochanteric fixed with TGN; finally, the finite element analysis of post TGN removal with healed trochanteric femoral fracture was performed. Isotropic material properties and load conditions of contact load and muscles (abductor, ilia-tibial tract, tensor fascia lata, vastus lateralis, vastus medialis), used in this study. The results of Von Mises stress in case of healed trochanteric is high especially in long femur model used as the result of high possibility to fracture. After healing process, the stress distribution is lower than yield strength, but it is still risk to break.due to fatigue failure. For TGN removal model, peak stress remains in neck region, but it doesn't in case of hole was fully filled. In shorts, we therefore recommend removing implant after healed process due to high stress located at distal screw hole and lag screw hole. And leaving until filled hole, then the peak stress reduced to safety level, which is better than leaving TGN in place after fracture healing. |
| Year | 2003 |
| Corresponding Series Added Entry | Asian Institute of Technology. Thesis ; no. ISE-03-33 |
| Type | Thesis |
| School | School of Advanced Technologies (SAT) |
| Department | Department of Industrial Systems Engineering (DISE) |
| Academic Program/FoS | Industrial Systems Engineering (ISE) |
| Chairperson(s) | Bohez, Erik L. J.; |
| Examination Committee(s) | Anulark Techanitisawad;Banchong Mahaisavariya, M.D;Jintamai Suwanprateep; |
| Scholarship Donor(s) | Royal Thai Government; |
| Degree | Thesis (M.Eng.) - Asian Institute of Technology, 2003 |