Design of a TCP/IP stack for system on chip (SOC) application | |
| Author | Surachai Thongkaew |
| Call Number | AIT Thesis no.ME-03-07 |
| Subject(s) | TCP/IP (Computer network protocol) Ethernet (Local area network systems |
| Note | A thesis submitted in partial fulfillment of the requirements for the degree of Master of Engineering, School of Advanced Technologies |
| Publisher | Asian Institute of Technology |
| Series Statement | Thesis ; no. ME-03-07 |
| Abstract | TCP/IP is a communication protocol stack designed to provide a reliable data stream between two hosts. It is a popular means of communicating data over a network. Most people use the protocol every day to check email, browse the web, instant message, and download files. TCP/IP is also becoming more utilized in embedded systems. TCP/IP is usually implemented in software as a service of an operating system (Linux, NetBSD, etc.). However, small projects may not require a full operating system, which uses a stand-alone protocol stack. The TCP/IP Stack Chip means the chip that is able to communicate with network by using protocol TCP/IP Stack. This protocol work with the mechanism of OIS Layer that consist of Physical Layer, Datalink Layer, Network Layer, Transport Layer, and Application Layer: that is reason why TCP/IP Stack Chip can work as "Embedded System" or can call it that "System On Chip" (SOC). The TCP/IP Stack Chip can work without Operation System, so it is suitable to use in small project that do not need Operation System to work in high potential. This focus on the of Internet technology with the aim of compressing this technology into a single chip, called "Internet Chip" or "TCP/IP Stack Chip" and Implementation Protocol TCP/IP Stack 3 layers: Datalink Layer, Network Layer, and Transp01t Layer on FPGA (Xilinx), while Application Layer and Physical Layer will be implemented on Micro Controller (89C51 AC2) and Internet Interface Unit (CS8900A) respectively. In The Future, if the Application Layer and Physical Layer can be implemented on FPGA, it will be developed to System On Chip (SOC). |
| Year | 2003 |
| Corresponding Series Added Entry | Asian Institute of Technology. Thesis ; no. ME-03-07 |
| Type | Thesis |
| School | School of Advanced Technologies (SAT) |
| Department | Department of Industrial Systems Engineering (DISE) |
| Academic Program/FoS | Microelectronics (ME) |
| Chairperson(s) | Lertsak Lekawat; |
| Examination Committee(s) | Afzulpurkar, Nitin V.;Chanmarn Punyasai; |
| Scholarship Donor(s) | Thailand Graduate of Science and Technology ( TGIST) Nation Science;Technology Development Agency (NSTDA); |
| Degree | Thesis (M.Eng.) - Asian Institute of Technology, 2003 |