1 AIT Asian Institute of Technology

An analysis of the RC pavement joint sealant damage mechanisms

AuthorNuttapol Kerdput
Call NumberAIT Thesis no.CM-04-05
Subject(s)Pavements, Reinforced concrete
Sealing (Technology)

NoteA thesis submitted in partial fu lfillment of the requirements for the degree of Master of Engineering, School of Civil Engineering
PublisherAsian Institute of Technology
Series StatementThesis ; no. CM-04-05
AbstractThis research work developes the finite element method to analyze the sealant in rigid pavement joint by focusing on its behavior under different shape factor, temperature and local environmental in Thailand to obtain a joint sealant damage mechanism from various factors and its deterioration respect to its service time. The 3D finite element analysis of the rigid pavement joint sealant and joint sealant fatigue property are presented. The displacement of slab edge surface on both sides of the rigid pavement expansion joint by traffic loading and curling effect can cause stress-strain in the joint sealant. This study conducts an experiment to obtain the fatigue property of the joint sealant that is subjected to cyclic movement which is induced by the traffic load and the curling effect in the rigid pavement slab. The results of the behavior analysis of joint sealant under different configurations and the damage analysis of joint sealant under fatigue loading are presented by the stress-strain and the relation of the percentage of joint sealant damage with respect to its service life respectively. This study can help better monitor the rigid pavement joint sealant deterioration under temperature and local environment in order to effectively maintain joint sealant performance and its serviceability at an acceptable level.
Year2004
Corresponding Series Added EntryAsian Institute of Technology. Thesis ; no. CM-04-05
TypeThesis
SchoolSchool of Civil Engineering
DepartmentOther Field of Studies (No Department)
Academic Program/FoSConstruction Engineering and Infrastructure Management (CM)
Chairperson(s)Pannapa Herabat;
Examination Committee(s)Hadikusumo, Bonaventura H.W. ; Pichai Nimityongskul; Barry, William J. ;
Scholarship Donor(s)Asian Institute of Technology Fellowship;
DegreeThesis (M.Eng.) - Asian Institute of Technology, 2004


Usage Metrics
View Detail0
Read PDF0
Download PDF0