Finite element analysis of FBGA package strength and solder joint characteristic life prediction | |
| Author | Polpatr Sattayacaruhakul |
| Call Number | AIT Thesis no.ME-01-08 |
| Subject(s) | Ball grid array technology Finite element method Electronic packaging |
| Note | A thesis submitted in partial fulfillment of the requirements for the degree of Master of Engineering, School of Advanced Technologies |
| Publisher | Asian Institute of Technology |
| Series Statement | Thesis ; no. ME-01-08 |
| Abstract | The finite element analysis (PEA) can help to identify electronic package design issues early in the design process and minimize the number of prototypes needed for testing. In this thesis, the finite element modeling of different constituent elements in a Fine-pitch Ball Grid Array (FBGA) package is performed with their material properties. The strnctures of electronic package are modeled with different conditions to verify mechanical and thermal failures. The mechanical failure will be based on three-point bending test. Then, the strength of the FBGA package will be optimized due to thickness minimization. Therefore, Design of Experiment (DOE) will be applied for this design optimization. For thermal failure, solder joint reliability will be an interest. The characteristic life of solder joint will be predicted by way of Robert Darveaux's theory under temperature cycling condition. The results from PEA solution will be compared with the experimental analysis solution at the same conditions. |
| Year | 2001 |
| Corresponding Series Added Entry | Asian Institute of Technology. Thesis ; no. ME-01-08 |
| Type | Thesis |
| School | School of Advanced Technologies (SAT) |
| Department | Department of Industrial Systems Engineering (DISE) |
| Academic Program/FoS | Microelectronics (ME) |
| Chairperson(s) | Afzulpurkar, Nitin V. |
| Examination Committee(s) | Lertsak Lekawat ;Itti Rittaporn ;Watana Sabyeying ; |
| Degree | Thesis (M.Eng.) - Asian Institute of Technology, 2001 |