| Author | Pradhan, Rojalin |
| Call Number | AIT Thesis no.ME-07-04 |
| Subject(s) | Integrated circuits--Design and construction
|
| Note | A thesis submitted in partial fulfillment of the requirements for the
degree of Master of Engineering in
Microelectronics, School of Engineering and Technology |
| Publisher | Asian Institute of Technology |
| Series Statement | Thesis ; no. ME-07-04 |
| Abstract | In this thesis work we have analyzed the reliability of ultra small packages under different test conditions and also investigated for the common failures that occur in this type of package. Of the several different categories of small thin CST) packages, three types of packages were used, namely, ST 553, ST 563 and ST 953. Firstly the package dimensions were measured and tested to be within specification. These packages were then tested for failures like external visible errors, wire bond faults, mold cracks, delamination within the packages and for internal die cracks under different failure analysis method. The most important factor was also to analyze the reasons for these failures. With the help of this test, the failure modes and mechanism has been found out on small thin package. Overall the small thin package reliability was found within the ZEDEC standard specification. One of the major concerns affecting the quality of the packages was delamination i.e. 40 %. Lead damage, marking error, incomplete mold, and cracks has also little impact on some of the small thin packages. This result shows the cause of delamination is mainly due to the moisture quantity inside the package. At high temperature of soldering process, moisture present in a plastic package can vaporize and exert stress on the package. This stress causes the package to crack and also causes delamination between the mold compound and the lead frame or die. Care should be taken necessary to control the moisture quantity inside small thin package |
| Year | 2007 |
| Corresponding Series Added Entry | Asian Institute of Technology. Thesis ; no. ME-07-04 |
| Type | Thesis |
| School | School of Engineering and Technology (SET) |
| Department | Department of Industrial Systems Engineering (DISE) |
| Academic Program/FoS | Microelectronics (ME) |
| Chairperson(s) | Dutta, Joydeep; |
| Examination Committee(s) | Afzulpurkar, Nitin;Monreal, Jess;Miura, Atsushi; |
| Scholarship Donor(s) | Asian Institute of Technology Fellowship; |
| Degree | Thesis (M.Eng.) - Asian Institute of Technology, 2007 |