1 AIT Asian Institute of Technology

MEMS based integrated transdermal drug delivery system

AuthorAshraf, Muhammad Waseem
Call NumberAIT Diss. no.ISE-12-03
Subject(s)Microelectromechanical systems

NoteA dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of Engineering in Microelectronics, School of Engineering and Technology
PublisherAsian Institute of Technology
Series StatementDissertation ; no. ISE-12-03
AbstractMicro and nano electromechanical system (MEMS and NEMS) based microfluidic devices are gaining popularity from last few years in biomedicine because of small size, light weight, low cost, ease of fabrication, accuracy, high efficiency and more reliability. Due to these attributes, MEMS and NEMS devices have unobtrusively and efficiently made their way into our daily lives. Appliances, automotives, electronic instrummentation, telecommuications, aeroscope, sensors technology, inkjet printing technology, office equipment, industrial process control, micro and nano fluidics devices, medical devices and system are few examples. Micro and nanofluidic systems deal with the fluid flow in diminutive amounts typically few microlitres (µL) to nanoliters (nL) in a miniaturized system. The main functions perfumed by these systems are sample preparation, purification, separation, reaction, transport, immobilization, labeling, biosensing and detection. Micro and nanofluidic devices are promising to meet the critical medical needs such as site specific dmg delive1y, reduced side effects, increased bioavailability and therapeutic effectiveness. Transdermal drug delive1y (TDD) is an attractive way to transfer the pharmaceutical compound by reducing pain, gastrointestinal absorption, liver metabolism, gastrointestinal and degradation. TDD system consists of micropumps, microneedles, drug reservoir, flow sensors, blood pressure sensors and electronic module. Microneedles and micropumps are two major and essential components of TDD system. Microneedles are used as an interface to transport the dmg from reservoir to patient body. Microneedles can be categorized according to their structure, fabrication process, materials, overall shape, tip shape, size and applications. Micropumps are used to facilitate the actuation mechanism for drug transportation. The important features of micropumps are working principles, actuation methods, construction, performance parameters and applications. Microneedles and micropumps are integrated to form TDD system. The aim of this research is to design and fabricate MEMS based hollow out-of-plane silicon microneedles for TDD system. Using ANSYS, structural and Multiphysics analyses have been conducted before the fabrication process of microneedles to test the design suitability for TDD. Simulation shows that the proposed design of microneedles is suitable for TDD. During structural analysis, the results show that 6.69 GPa stress occurs at the microneedle bottom with 20 µm deflection at the tip for applied force of 8.8 N. Numerical results show that the presented design of tapered tip microneedles can easily bear· the shear, axial, bending, :fictional and lateral forces equal to 8.8 N during penetration into the patient body. Coupled field analysis of reservoir integrated with microneedle array using piezoelectric actuator has also been perfo1med. The effects of frequency and voltage on actuator and fluid flow rate through 6x6 microneedle a1rny have been investigated. Multifield analysis shows that the maximum fluid flow rate of 612 µL/min is obtained at applied voltage of 100 V through 6x6 microneedle array with actuator deflection of 12.24 µm. After the selection of suitable design of microneedles for TDD system, the actual fabrication of tapered tip silicon hollow out-of-plane microneedles has been cru1ied out using inductively coupled plasma (ICP) etching technology.
Year2012
Corresponding Series Added EntryAsian Institute of Technology. Dissertation ; no. ISE-12-03
TypeDissertation
SchoolSchool of Engineering and Technology (SET)
DepartmentDepartment of Industrial Systems Engineering (DISE)
Academic Program/FoSIndustrial Systems Engineering (ISE)
Chairperson(s)Afzulpurkar, Nitin V.;
Examination Committee(s) Adisom Tuantranont ;Bohez, Erik L.J. ;Sun, Yu;
Scholarship Donor(s)Higher Education Commission (HEC), Pakistan, Asian Institute of Technology Fellowship ;
DegreeThesis (Ph. D.) - Asian Institute of Technology, 2012


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