Future of IC packaging subcontract assembly industry in Thailand | |
| Author | Suwan Trongjitwikrai |
| Call Number | AIT Thesis no.ESM-99-12 |
| Subject(s) | Packaging--Management Business planning--Thailand Strategic planning|--Thailand |
| Note | A thesis submitted in partial fulfillment of the requirements for the degree of Master of Business Administration (Executive MBA Program) |
| Publisher | Asian Institute of Technology |
| Abstract | The market potential of IC packaging subcontract is enormous. The CAGR is estimated to be in double digits from 1997 to 2002. The 1997 exports of IC subcontract packaging from Thailand is only accounted for about four percents of the worldwide total IC packaging subcontract revenue. There are a lot of opportunities for the local IC packaging subcontractors to be explored. However, the competitions from other foreign competitors are fierce and the technology is constantly evolving to meet the increasing performance of the Ie. This research study will first review the critical success factors in the IC packaging subcontract industry and then perform SWOT analysis on the Thai IC packaging subcontract industry. Recommendations are proposed to governmental policy makers, academic researchers and industry strategic planners. The future prospects of the IC packaging subcontract industry is as promising as it has ever been. Both short term and long term strategic planning for all involved parties will ensure the future success or failure of this highly competitive industry. |
| Year | 1999 |
| Type | Thesis |
| School | School of Management |
| Academic Program/FoS | Master of Business Administration (Executive)-(EMBA) (Publication code = ESM) |
| Chairperson(s) | Gupta, Joyti |
| Examination Committee(s) | Paul, Himangshu;Johri, Lalit M. |
| Degree | Thesis (M.B.A.) - Asian Institute of Technology, 1999 |