1 AIT Asian Institute of Technology

Effect of moisture on physical and mechanical properties of plywood in Thailand

AuthorChaiyuth Pitakteeratham
Call NumberAIT Thesis no. ST-80-01
Subject(s)Plywood
Building materials--Moisture
NoteA thesis submitted in partial fulfillment of the requirements for the degree of Master of Engineering, School of Engineering and Technology
PublisherAsian Institute of Technology
AbstractThe physical and mechanical properties of locally available plywood having different degrees of moisture and thicknesses are presented. Bending, compression, tension and shear tests of clear plywood specimens are performed to determine the bending stress at proportional limit, modulus of rupture, modulus of elasticity, ultimate compressive and tensile strength, and shear strength. The ranges of moisture content are selected based on the duration of soaking in water of plywood. The methods of testing adopted are based on ASTM Standards except for shear test. The experimental results are compared with those reported by the Royal Forest Department of Thailand. Test results reveal that the performance of 6 mm. thick plywood is considerably affected by the moisture content. The mechanical properties of 10 and 15 mm. thick plywood under both normal and moist conditions are found to be superior to other plywood tested. Failure patterns of plywood specimens indicate that the strength of glue bond between layers of veneer is the most important factor governing the failure of plywood under moist conditions. The quality of adhesive should be improved if plywood is intended for use in exposed environment.
Year1980
TypeThesis
SchoolSchool of Engineering and Technology
DepartmentDepartment of Civil and Infrastucture Engineering (DCIE)
Academic Program/FoSStructural Engineering (STE) /Former Name = Structural Engineering and Construction (ST)
Chairperson(s) Pichai Nimityongskul
Examination Committee(s)Karasudhi, Pisidhi ;Worsak Kanok-Nukulchai
Scholarship Donor(s)Canadian Government
DegreeThesis (M.Eng.) - Asian Institute of Technology, 1980


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