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Results For "Electronic packaging" in Subject
2 Results on April 19, 2025
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School of Civil Engineering
Student Research Before 1978
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FEA modeling study on the reliability and performance of a flip-chip IC package
by
Zhang, Nina
Callnumber:
AIT Thesis no.ME-03-08
Finite element analysis of FBGA package strength and solder joint characteristic life prediction
by
Polpatr Sattayacaruhakul
Callnumber:
AIT Thesis no.ME-01-08
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